|
|
|
Environmental and Physical Factors
|
|
|
The smart card IC's needs to go through several qualification processes
before it could be embedded into the card material. Environment
(temperature changes), Mechanics (how the card will 'flex'), physicality
(how many bond layers) and the actual composition of the chip are the few
process that it need to go through.
|
|
|
|
IC Manufacturer's Reliability
|
|
|
The buyer must consider the reliability of the IC, which is dependent on
the manufacturer. The rejection rate, tools provided (emulator, simulator),
overall quality and price are just a few factors it need to be considered.
|
|
|
|
Functionality Factors
|
|
|
The most important of all would be the functions allowed by the chips itself.
Things like internal security, supported algorithms (RSA,DES), memory and the
operating systems are all key factors that need to take note.
|
